MULTILAYER WIRING BOARD, SEMICONDUCTOR DEVICE PACKAGE AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a multilayer wiring board wherein a wiring pattern adjacent to a dummy pattern is formed with high precision, and also to provide a semiconductor device package and an electronic apparatus. SOLUTION: In the multilayer wiring board 1, a plurality of unit wiring boards...

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Bibliographische Detailangaben
Hauptverfasser:	ARAI TOSHIMITSU, OKUMA TAKAMASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a multilayer wiring board wherein a wiring pattern adjacent to a dummy pattern is formed with high precision, and also to provide a semiconductor device package and an electronic apparatus. SOLUTION: In the multilayer wiring board 1, a plurality of unit wiring boards 5, on each of which the wiring patterns 3 and 3A consisting of conductors, and the dummy pattern 4 consisting of a conductor and arranged having a dummy clearance C2 of a predetermined width between it and the wiring pattern 3A being provided, are laminated on an insulating substrate 2, and a linear clear pattern 8 parallel to the adjacent wiring pattern 3A is provided on the dummy pattern 4 by partially removing the conductor. COPYRIGHT: (C)2008,JPO&INPIT