METHOD OF MANUFACTURING MICROCHIP, AND MICROCHIP

PROBLEM TO BE SOLVED: To provide a method of manufacturing a microchip capable of facilitating the positioning microchip substrates to more strongly joint the microchip substrates to each other. SOLUTION: A groove 2 for a flow channel is formed to the surface of the microchip substrate 1 and a pin 3...

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Bibliographische Detailangaben
Hauptverfasser:	SEKIHARA MIKIJI, KAMIHIRA MASAYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TESTING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a microchip capable of facilitating the positioning microchip substrates to more strongly joint the microchip substrates to each other. SOLUTION: A groove 2 for a flow channel is formed to the surface of the microchip substrate 1 and a pin 3 is provided to the surface having the groove 2 for the flow channel formed to the microchip substrate 1 so as to be protruded in a direction of crossing the surface of the microchip substrate 1 at a right angle. A through-hole 5 is formed to a microchip substrate 4 so as to pierce the substrate in its thickness direction. The diameter of the through-hole 5 is almost equal to the diameter of the pin 3. The surface having the groove 2 for the flow channel formed to the microchip substrate 1 is made inside with respect to the microchip substrate 1, and the microchip substrate 1 and the microchip substrate 4 are superimposed on each other, to insert the pin 3 in the through hole 5. In a state where the pin 3 is inserted in the through hole 5, the microchip substrates 1 and 4 are jointed by ultrasonic or laser welding. COPYRIGHT: (C)2008,JPO&INPIT