HIGH-STRENGTH, HIGH-CONDUCTIVITY COPPER ALLOY AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To obtain an inexpensive high-strength, high-conductivity copper alloy in which mechanical strengths represented by tensile strength and hardness are improved to values higher than those in JIS Z 3234 type III standard without deteriorating physical properties and the additive...

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Bibliographische Detailangaben
Hauptverfasser: KURAMOTO SHIGERU, EGUCHI ITSUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain an inexpensive high-strength, high-conductivity copper alloy in which mechanical strengths represented by tensile strength and hardness are improved to values higher than those in JIS Z 3234 type III standard without deteriorating physical properties and the additive quantity of expensive Ni is reduced and which is free of Be and has ≥820 N/mm2tensile strength, ≥244 hardness by HB (10/3000) and ≥35% IACS electrical conductivity. SOLUTION: This copper alloy has a composition which consists of, by weight, 3.30 to 6.0% Ni, 0.8 to 1.7% Si, 0.5 to 1.5% Cr, 0.1 to 0.3% Sn and the balance Cu excluding inevitable impurities and in which the value of Ni/Si by weight ratio ranges from 3 to 4. The copper alloy has ≥820 N/mm2tensile strength, ≥244 hardness by HB (10/3000) and ≥35% IACS electrical conductivity. COPYRIGHT: (C)2008,JPO&INPIT