MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which is not easily damaged. SOLUTION: The manufacturing method of the semiconductor device comprises: a process of forming a lower electrode material; a process of forming a capacitor material on the lower electrode m...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SUNADA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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