BUMP-BONDING DEVICE

PROBLEM TO BE SOLVED: To move a thin semiconductor die on a bonding stage smoothly, at a high speed and form the bump at the peripheral part of the thin semiconductor die, in a bump bonding device. SOLUTION: A position correcting pawl 25 is provided with a thickness which is contacted with the corner surface 15 of the bonding stage 13, arranged with a level difference from a stage substrate 16 and the corner surface 23 of the semiconductor die 21. A position correcting claw moving mechanism 12 effects positional correction of the semiconductor die 21, by moving the corner surface 23 of the semiconductor die 21, disposed on the corner 17 so that one part thereof is overhung from the surface of the bonding stage 13 by the position correcting claw 25, toward the corner 17 of the bonding stage 13, until the corner surface 23 is contacted with the corner surface 15 of the bonding stage 13. The position correcting claw moving mechanism 12 effects positional correction of the semiconductor die 21, in synchronization with the movement of the bonding stage 13 into the feeding direction thereof. COPYRIGHT: (C)2008,JPO&INPIT