CIRCUIT DEVICE, MANUFACTURING PROCESS OF CIRCUIT DEVICE, AND SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a technology for enhancing the connection reliability of wiring in a circuit device. SOLUTION: The circuit device 10 comprises a semiconductor substrate 12 on which a circuit element is formed, an electrode 14 formed on the surface S of the semiconductor substrate 12, an insulating resin layer 16 provided on the electrode 14 and containing glass fibers 17 oriented to intersect the direction perpendicular to the surface of the substrate, a rewiring pattern 18 provided on the insulating resin layer 16, and a conductive bump 20 for connecting the electrode 14 and the rewiring pattern 18 by penetrating the insulating layer 16. The glass fiber 17 has a thermal expansion coefficient smaller than that of the insulating layer 16 and bending toward the rewiring pattern 18 in the vicinity of the conductive bump 20. COPYRIGHT: (C)2008,JPO&INPIT