MEASURING METHOD OF GEOMETRIC VARIABLE OF WAFER

PROBLEM TO BE SOLVED: To provide a method for measuring with reliability the central point of a wafer to be measured, regardless of the peripheral configurations of the wafer. SOLUTION: A wafer holder 30 for inserting the wafer 16 includes three or more physical contact elements 22. The wafer comes...

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Bibliographische Detailangaben
Hauptverfasser:	DANIEL SKIERA, SCHENK RENE, FRIEDRICH RALF, IFFLAND THOMAS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for measuring with reliability the central point of a wafer to be measured, regardless of the peripheral configurations of the wafer. SOLUTION: A wafer holder 30 for inserting the wafer 16 includes three or more physical contact elements 22. The wafer comes into a physical contact with the contact elements 22. The contact elements are arranged separately in the wafer holder 30 so as to define a geometry which keeps the central point 40 of the wafer 16 in it. The position of each contact element 22 is measured, and geometric variables of the desired wafer 16 are calculated from the positions of the contact elements 22. COPYRIGHT: (C)2008,JPO&INPIT