FLAME-RESISTANT ADHESIVE RESIN COMPOSITION AND COVER-LAY FILM USING IT

PROBLEM TO BE SOLVED: To provide a non-halogen, non-phosphorous and flame-resistant adhesive film for a printed circuit board which can be compression-bonded at a low-temperature of 250°C or lower, also is superior in heat resistance, the solder heat resistance in a wet state, processability and the...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIDA TAKUZO, TOKUHISA KIWAMU, MORI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a non-halogen, non-phosphorous and flame-resistant adhesive film for a printed circuit board which can be compression-bonded at a low-temperature of 250°C or lower, also is superior in heat resistance, the solder heat resistance in a wet state, processability and the like. SOLUTION: The flame-resistant adhesive resin composition essentially containing no halogen element is formed by blending 1-45 pts.wt. of a phosphate-based plasticizer into 100 pts.wt. of a mixed resin comprising 65-98 wt.% of a silicon unit-containing polyimide resin, and 2-35 wt.% of an acenaphtylene-modified epoxy resin having a structure formed by epoxidizing a naphthol resin having a structure formed by substituting a naphthalene ring for an acenaphthenyl group. COPYRIGHT: (C)2008,JPO&INPIT