JOINING METHOD USING INTERMETALLIC COMPOUND

PROBLEM TO BE SOLVED: To provide a joining process where the reduction of joining temperature is attained in a joining stage of a packaging process, and organic matter residue after joining is reduced. SOLUTION: This invention is characterized in that an oxygen-containing oxide layer is formed on th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MABUCHI KATSUMI, MORITA TOSHIAKI, YASUDA TAKESUKE, AKABOSHI HARUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER
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