JOINING METHOD USING INTERMETALLIC COMPOUND

PROBLEM TO BE SOLVED: To provide a joining process where the reduction of joining temperature is attained in a joining stage of a packaging process, and organic matter residue after joining is reduced. SOLUTION: This invention is characterized in that an oxygen-containing oxide layer is formed on the joining boundary of the members to be joined, a material for joining containing metallic compound particles with the average particle diameter of 1 nm to 50 μm and a reducing agent composed of organic matter is arranged at the joining boundary, and thereafter, the members to be joined are heated and pressurized, so as to join the members to be joined. Further, the metallic compound is composed of one or more kinds of metallic compound particles selected from the particles of metal oxides, metal carbonates and the metal salts of carboxylic acid. COPYRIGHT: (C)2008,JPO&INPIT