ADHESIVE COMPOSITION, METHOD FOR PRODUCING THE SAME, ADHESIVE FILM PRODUCED USING THE COMPOSITION, SUBSTRATE FOR MOUNTING SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an adhesive composition which has heat resistance and moisture resistance required for mounting a semiconductor device on a wiring board for mounting semiconductor, where the semiconductor device has a coefficient of thermal expansion significantly differing from tha...

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Hauptverfasser:	KAWAKAMI HIROYUKI, SUZUKI MASAO, HOSOKAWA YOICHI, HATAKEYAMA KEIICHI, TANAKA HIROKO, TOMIYAMA TAKEO, SHIMADA YASUSHI, INADA TEIICHI, SUMIYA KEIJI, KURITANI HIROYUKI, IWAKURA TETSUO, MATSUZAKI TAKAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive composition which has heat resistance and moisture resistance required for mounting a semiconductor device on a wiring board for mounting semiconductor, where the semiconductor device has a coefficient of thermal expansion significantly differing from that of the wiring board, and with which an adhesive film capable of suppressing volatiles upon the use thereof can be formed, a method for producing the adhesive composition, an adhesive film produced using the adhesive composition, a substrate for mounting a semiconductor, and a semiconductor device. SOLUTION: Provided are the method for producing an adhesive composition comprising (a) an epoxy resin, (b) a curing agent, and (c) a polymeric compound incompatible with the epoxy resin and optionally (d) a filler and/or (e) a curing accelerator, the adhesive film prepared by forming the adhesive composition into the form of a film, the wiring board for mounting a semiconductor provided with the adhesive film on the surface for mounting chips of the wiring board, and a semiconductor device produced using the adhesive film or the wiring board for mounting semiconductor. COPYRIGHT: (C)2008,JPO&INPIT