PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a wiring board which achieves inter-layer connection while keeping a conductive layer serving as a surface layer thin for formation of a fine pattern to offer superior via connection reliability. SOLUTION: The printed wiring board has such a via-hole that a bottomed hole is so formed on an insulating layer sandwiched between a first conductive layer and a second conductive layer as to expose the surface of the first conductive layer and is filled with a conductive for connection. The printed wiring board includes a third conductive layer formed only on the wall surface of the insulating layer that is on the via-hole side, and a fourth conductive layer which is so formed as to cover the surface of the second conductive layer and the entire inner wall surface of the via-hole. COPYRIGHT: (C)2008,JPO&INPIT