SUBSTRATE LAMINATING METHOD, MANUFACTURING METHOD OF MICROCHIP, AND THE MICROCHIP

PROBLEM TO BE SOLVED: To provide a substrate laminating method that has superior productivity, causes no deformation of channel patterns, even if a fine channel pattern is formed on a substrate, and to provide a manufacturing method of microchips, and microchips with the deformation of a fluid circu...

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Bibliographische Detailangaben
1. Verfasser:	SHIMAZAKI TAKAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TESTING THEIR RELEVANT APPARATUS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate laminating method that has superior productivity, causes no deformation of channel patterns, even if a fine channel pattern is formed on a substrate, and to provide a manufacturing method of microchips, and microchips with the deformation of a fluid circuit controlled. SOLUTION: The method for laminating a first substrate (101), consisting of a thermoplastic resin through which light transmits and a second substrate (102) consisting of a thermoplastic resin in which a light-absorbing substance is dispersed, comprises steps of (A) adjusting the temperature of the laminated surface, of at least one of substrates close to the glass transition temperature of the thermoplastic resin that constitutes the substrate by a heating plate (104), and the like, (B) applying pressure on the superimposed first substrate (101) and the second substrate (102), and (C) irradiating a light (105) to the light-absorbing substance via the first substrate. COPYRIGHT: (C)2008,JPO&INPIT