HIGHLY ADHESIVE POLYIMIDE FILM AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a polyimide film improved in adhesiveness. SOLUTION: This polyimide film comprising (1) a polyimide obtained from 1,4-phenylenediamine, 4,4'-diaminodiphenyl ether, pyromellitic dianhydride and 3,3', 4,4'-biphenyltetracarboxylic dianhydride and (2) inor...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YASUDA MASABUMI, ISHIKAWA HIRONORI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyimide film improved in adhesiveness. SOLUTION: This polyimide film comprising (1) a polyimide obtained from 1,4-phenylenediamine, 4,4'-diaminodiphenyl ether, pyromellitic dianhydride and 3,3', 4,4'-biphenyltetracarboxylic dianhydride and (2) inorganic particles having particle size in a range of 0.01 to 1.5 μm and having an average particle size of 0.05 to 0.7 μm in an amount of 0.1 to 0.9 wt.% based on the weight of the polyamic acid is characterized in that the powder is uniformly dispersed in the polyimide film and the polyimide film has a surface free energy of ≥80 mN/m measured on the basis of a contact angle method by applying an electric discharge treatment to the film. The present invention further includes a method for producing the polyimide film. COPYRIGHT: (C)2008,JPO&INPIT