METHOD AND APPARATUS FOR COATING

PROBLEM TO BE SOLVED: To form a smooth coated film having no unevenness on a substrate to be treated. SOLUTION: In this resist coating treatment, an ultrasonic wave irradiating part 160 is moved with on-state at right after a resist nozzle 154 on and after the second scanning in the Y direction, tha...

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Bibliographische Detailangaben
Hauptverfasser:	IWASAKI YOSHIHIKO, TATEYAMA KIYOHISA, MOTODA KIMIO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR NOZZLES ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To form a smooth coated film having no unevenness on a substrate to be treated. SOLUTION: In this resist coating treatment, an ultrasonic wave irradiating part 160 is moved with on-state at right after a resist nozzle 154 on and after the second scanning in the Y direction, that is, together with the resist nozzle 154 while ultrasonic wave is irradiated to the vicinity of the boundary E between both zonal resist liquid films R(1), R(2). A resist liquid becomes low viscous or fluid in the vicinity of the boundary E between the both zonal resist liquid films R(1), R(2) by the ultrasonic wave irradiation scanning of the ultrasonic wave irradiating part 160 so as to even the surface of the liquid film in the direction parallel to a substrate surface, which results in removing the unevenness. COPYRIGHT: (C)2008,JPO&INPIT