METHOD OF MANUFACTURING WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method that allows efficient manufacturing of a thin and high-density wiring board. SOLUTION: The method includes steps of: depositing a metal foil 11 above a main surface of a support substrate 1 having the planar main surface via a semisolid intervening layer 2 and forming a sealing member 3 for tightly sealing the intervening layer 2 between the outer regions of the main surface and the metal foil 11; alternately laminating a plurality of insulating layers 21 to 25 and conductor layers 12 to 15 on the metal foil 11 to form a laminate 10 for a wiring board comprised of the metal foil 11, insulating layers 21 to 25, and conductor layers 12 to 15; separating the laminate 10 located at an inside region of the sealing member 3 from the sealing member 3; and separating the separated laminate 10 from the support substrate 1 at the intervening layer 2. COPYRIGHT: (C)2008,JPO&INPIT