SUBSTRATE MOUNTING STAGE AND ITS SURFACE PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a substrate mounting stage which can enhance an operating ratio of a substrate processor by suppressing a sucking faulty for a substrate. SOLUTION: The substrate processor 10 has a chamber 11 for accommodating a wafer W, and a mounting stage 12 for mounting thereon the wafer W is disposed in the chamber 11. An electrostatic chuck 42 is disposed above the mounting stage 12, and a spray deposit 51 is formed on a surface of the electrostatic chuck 42. A grindstone 52 which is disk-shaped by fixing an abrasive grain comes into contact with the electrostatic chuck 42, thereby grinding the surface thereof, and a lap surface plate 57 in which a slurry obtained by mixing the abrasive grain and a lubricant is sprayed onto its surface comes into contact with the electrostatic chuck 42, thereby grinding the surface thereof flatly. An abrasive grain 58 collides with the surface at a given blowout pressure, thereby grinding the surface roughly, and a corresponding tape 5 of a tape lap device 4 having the tape 5 to which an abrasive grain 9 is coated and fixed and a roller 6 composed of an elastic body comes into contact with the electrostatic chuck 42, thereby smoothing the surface thereof. COPYRIGHT: (C)2008,JPO&INPIT