METHOD OF FORMING CONDUCTIVE CIRCUIT
PROBLEM TO BE SOLVED: To provide a method of forming a highly reliable conductive circuit which can be formed by simple operation and obtain enough conductivity. SOLUTION: In the method, a conductive circuit is readily formed at low cost by drawing a circuit pattern on an insulating substrate by usi...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method of forming a highly reliable conductive circuit which can be formed by simple operation and obtain enough conductivity. SOLUTION: In the method, a conductive circuit is readily formed at low cost by drawing a circuit pattern on an insulating substrate by using an organic material containing a metal particle, especially a metal particle which is subjected to anti-oxidation treatment in a surface, and by baking the circuit pattern by heating and treating at a temperature of 5% loss weight temperature ±10°C of the organic material. COPYRIGHT: (C)2008,JPO&INPIT |
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