MANUFACTURING METHOD OF MULTILAYER ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer electronic component, capable of improving molding density. SOLUTION: The manufacturing method of a multilayer electronic component has a green chip aggregate preparing step of preparing a green chip aggregate 40 having a plural...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SHINDO HIROSHI, TAKAHASHI MAKOTO, OHATA OSAMU, YAGI HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer electronic component, capable of improving molding density. SOLUTION: The manufacturing method of a multilayer electronic component has a green chip aggregate preparing step of preparing a green chip aggregate 40 having a plurality of green chips 50 having main surfaces 50a, 50b and sheet members 41, 42, the sheet member 41 being disposed on the main surface 50a of each of the plurality of green chips 50, the sheet member 42 being disposed on the main surface 50b of each of the plurality of green chips 50, and the plurality of green chips 50 being held with the sheet members 41, 42 in a state of being separated from each other; and a pressing step of pressing the plurality of green chips 50 via the sheet members 41, 42. COPYRIGHT: (C)2008,JPO&INPIT