MULTILAYER FILM OF POLYIMIDE PRECURSOR SOLUTION, MULTILAYER POLYIMIDE FILM, SINGLE SIDED METAL-CLAD LAMINATED SHEET AND MANUFACTURING METHOD OF MULTILAYER POLYIMIDE FILM

PROBLEM TO BE SOLVED: To provide a base material for a metal-clad laminated sheet enhanced in the interlaminar adhesiveness of a high heat-resistant polyimide and a thermoplastic polyimide and also enhanced in solder heat resistance. SOLUTION: A multilayer film of a polyimide precursor solution is c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YANAGIDA MASAMI, UEJIMA KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a base material for a metal-clad laminated sheet enhanced in the interlaminar adhesiveness of a high heat-resistant polyimide and a thermoplastic polyimide and also enhanced in solder heat resistance. SOLUTION: A multilayer film of a polyimide precursor solution is constituted by laminating at least a solution layer (a) containing the thermoplastic polyimide and/or the precursor of the thermoplastic polyimide, a solution layer (b) containing a non-thermoplastic polyimide precursor and a solution layer (a') containing the thermoplastic polyimide and/or the precursor of the thermoplastic polyimide in this order and the non-thermoplastic polyimide precursor contained in the solution layer (b) has a thermoplastic block component in its molecule. COPYRIGHT: (C)2008,JPO&INPIT