PHOTOSENSITIVE SILOXANE COMPOSITION, CURED FILM FORMED FROM THE SAME AND DEVICE WITH CURED FILM

PROBLEM TO BE SOLVED: To provide a photosensitive siloxane composition having low cure shrink properties and capable of giving a cured film which excels in transparency after heat curing, suppresses cracking after impregnation with an alkali solvent and excels in adhesiveness to a substrate. SOLUTIO...

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Bibliographische Detailangaben
1. Verfasser:	SUWA MITSUFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive siloxane composition having low cure shrink properties and capable of giving a cured film which excels in transparency after heat curing, suppresses cracking after impregnation with an alkali solvent and excels in adhesiveness to a substrate. SOLUTION: The photosensitive siloxane composition comprises: (a) a polysiloxane obtained by reacting an imide group-containing silane compound represented by general formula (1) with one or more organosilane compounds; (b) a quinonediazide compound; and (c) a solvent; wherein respective R1s may be the same or different and each represents one of a 1-6C alkyl group, a 1-6C alkoxyl group, a phenyl group, a phenoxy group and an organic group in which those are substituted; R2represents a 1-10C divalent organic group; and R3represents a 5-20C organic group containing no silicon atom. COPYRIGHT: (C)2008,JPO&INPIT