METHOD FOR CUTTING ALONG CUT-LINE AND PAPER CUT ALONG CUT-LINE

PROBLEM TO BE SOLVED: To provide a method for cutting paper along a cut-line so that a cut surface is made smooth without a possibility of breakage, the paper as a target having thickness as thin as 1.0 mm or less, and a paper container or paper comprising a sheet used therefor. SOLUTION: The method...

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Bibliographische Detailangaben
Hauptverfasser: ISOBE MINESATO, KOIZUMI HARUO, MARUMOTO MASARU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for cutting paper along a cut-line so that a cut surface is made smooth without a possibility of breakage, the paper as a target having thickness as thin as 1.0 mm or less, and a paper container or paper comprising a sheet used therefor. SOLUTION: The method for cutting paper container 1 or paper comprising the sheet along the cut-line, the paper having the thickness of 1.0 mm or less, comprises: a method, for cutting paper along a cut-line, comprising a process of smoothening the cut surface by providing a lower half cutting line 24 from a reverse side to an upper half cutting line 23 from an obverse side at an interval of 1.0 to 3.5 mm in parallel as a cut-line, a process of cutting against the intervals of the both half cutting lines 23, 24 by rolling the paper to the obverse side, and a process of generating only the upper half cutting line 23 on the obverse side by the cut surface 27; a method, for cutting paper along a cut-line, comprising a process of generating the upper half cutting line on the obverse side and edging of the lower half cutting line on the reverse side by the cut surface; and the paper therefor. COPYRIGHT: (C)2008,JPO&INPIT