BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE

BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE

PROBLEM TO BE SOLVED: To provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. SOLUTION: There i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IDE HIDEKAZU, ISHII TOSHIAKI, MORITA TOSHIAKI, YASUDA TAKESUKE, HOZOJI HIROYUKI
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. SOLUTION: There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 mum and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material. COPYRIGHT: (C)2008,JPO&INPIT