MANUFACTURING METHOD OF ELEMENT SUBSTRATE

PROBLEM TO BE SOLVED: To provide a manufacturing method of an element substrate where a metal layer having a fine pattern is formed precisely. SOLUTION: The element substrate 100 has a metal layer formed by an electroless plating method. The element substrate 100 includes a substrate 10, and a metal...

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Bibliographische Detailangaben
Hauptverfasser:	FURUHATA HIDEMICHI, SAWAKI DAISUKE, KIJIMA TAKESHI, AMAKO ATSUSHI, KANEDA TOSHIHIKO, KIMURA SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of an element substrate where a metal layer having a fine pattern is formed precisely. SOLUTION: The element substrate 100 has a metal layer formed by an electroless plating method. The element substrate 100 includes a substrate 10, and a metal layer 34 formed on the substrate, where the metal layer has a line width of not less than 20 nm and not more than 100 nm. COPYRIGHT: (C)2008,JPO&INPIT