FLUX APPLICATION METHOD, SOLDER BONDING METHOD, AND LEAD PIN

PROBLEM TO BE SOLVED: To solve a conventional problem that when a flux is applied to a connection portion of a through-hole of a substrate and a lead pin by means of spray application, the application of flux into the entire through-hole is difficult, an excellent solder property is hardly obtained,...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	OKOCHI TERUO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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