FLUX APPLICATION METHOD, SOLDER BONDING METHOD, AND LEAD PIN

PROBLEM TO BE SOLVED: To solve a conventional problem that when a flux is applied to a connection portion of a through-hole of a substrate and a lead pin by means of spray application, the application of flux into the entire through-hole is difficult, an excellent solder property is hardly obtained,...

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Bibliographische Detailangaben
1. Verfasser:	OKOCHI TERUO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve a conventional problem that when a flux is applied to a connection portion of a through-hole of a substrate and a lead pin by means of spray application, the application of flux into the entire through-hole is difficult, an excellent solder property is hardly obtained, and since the mist of the flux is dispersed to the periphery, the maintenance of equipment is complicated. SOLUTION: In the method of applying a flux to a lead pin 1 which is solder-bonded to a through-hole 12 in a state in which the pin is inserted into the through-hole 12 formed in a printed circuit board 11, a concavity 1a is formed on the outer periphery surface of the insertion portion of the lead pin 1 to the through-hole 12, the flux 31 is held in the concavity 1a, and thus the flux 31 is applied to the lead pin 1. COPYRIGHT: (C)2008,JPO&INPIT