HEAT CURING RESIN SHEET FOR SEALING, ELECTRONIC COMPONENT DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT DEVICE

PROBLEM TO BE SOLVED: To provide a heat curing resin sheet of a clay shape and an electronic component device capable of fully filling resin into a required portion and sealing an electronic element by a simple process without hindering any electronic function part of the electronic element of a surface acoustic wave element or the like fixed to a wiring substrate, and a method of manufacturing the electronic component device. SOLUTION: This invention relates to an electronic component device 47 which laminates a heat curing resin sheet 45 for sealing of the clay shape which can be plastically deformed by an external force, on the electronic element of a surface acoustic wave element 42 or the like fixed to a wiring substrate 41, and forms and seals an airtight space 46 without hindering any electronic function part of the electronic element with the resin by heating and curing this resin sheet. COPYRIGHT: (C)2008,JPO&INPIT