FLEXIBLE BOARD AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a flexible board improved in heat radiation properties and miniaturized, and also to provide a semiconductor device having the flexible board. SOLUTION: A base material 3 has a semiconductor chip mounting region 8 and a metal foil pattern forming region 4 on the uppe...
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| creator | KITAZAKI HIROAKI NAITO KATSUYUKI |
| description | PROBLEM TO BE SOLVED: To provide a flexible board improved in heat radiation properties and miniaturized, and also to provide a semiconductor device having the flexible board. SOLUTION: A base material 3 has a semiconductor chip mounting region 8 and a metal foil pattern forming region 4 on the upper surface. A plurality of wiring patterns 2 made of a copper foil are formed in the metal foil pattern formation region 4. The plurality of wiring patterns 2 are formed in one portion of the metal foil pattern formation region 4 so that the ratio of the width of the wiring pattern 2 to the interval between the wiring patterns 2 becomes not less than 1 and not more than 8.7. COPYRIGHT: (C)2008,JPO&INPIT |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2008177402A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2008177402A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2008177402A3</originalsourceid><addsrcrecordid>eNrjZFB383GN8HTycVVw8ncMclFw9HNRCHb19XT293MJdQ7xD1JwcQ3zdHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgYWhubmJgZGjsZEKQIAF70kFQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FLEXIBLE BOARD AND SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>KITAZAKI HIROAKI ; NAITO KATSUYUKI</creator><creatorcontrib>KITAZAKI HIROAKI ; NAITO KATSUYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a flexible board improved in heat radiation properties and miniaturized, and also to provide a semiconductor device having the flexible board. SOLUTION: A base material 3 has a semiconductor chip mounting region 8 and a metal foil pattern forming region 4 on the upper surface. A plurality of wiring patterns 2 made of a copper foil are formed in the metal foil pattern formation region 4. The plurality of wiring patterns 2 are formed in one portion of the metal foil pattern formation region 4 so that the ratio of the width of the wiring pattern 2 to the interval between the wiring patterns 2 becomes not less than 1 and not more than 8.7. COPYRIGHT: (C)2008,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080731&DB=EPODOC&CC=JP&NR=2008177402A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080731&DB=EPODOC&CC=JP&NR=2008177402A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KITAZAKI HIROAKI</creatorcontrib><creatorcontrib>NAITO KATSUYUKI</creatorcontrib><title>FLEXIBLE BOARD AND SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a flexible board improved in heat radiation properties and miniaturized, and also to provide a semiconductor device having the flexible board. SOLUTION: A base material 3 has a semiconductor chip mounting region 8 and a metal foil pattern forming region 4 on the upper surface. A plurality of wiring patterns 2 made of a copper foil are formed in the metal foil pattern formation region 4. The plurality of wiring patterns 2 are formed in one portion of the metal foil pattern formation region 4 so that the ratio of the width of the wiring pattern 2 to the interval between the wiring patterns 2 becomes not less than 1 and not more than 8.7. COPYRIGHT: (C)2008,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB383GN8HTycVVw8ncMclFw9HNRCHb19XT293MJdQ7xD1JwcQ3zdHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgYWhubmJgZGjsZEKQIAF70kFQ</recordid><startdate>20080731</startdate><enddate>20080731</enddate><creator>KITAZAKI HIROAKI</creator><creator>NAITO KATSUYUKI</creator><scope>EVB</scope></search><sort><creationdate>20080731</creationdate><title>FLEXIBLE BOARD AND SEMICONDUCTOR DEVICE</title><author>KITAZAKI HIROAKI ; NAITO KATSUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2008177402A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KITAZAKI HIROAKI</creatorcontrib><creatorcontrib>NAITO KATSUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KITAZAKI HIROAKI</au><au>NAITO KATSUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLEXIBLE BOARD AND SEMICONDUCTOR DEVICE</title><date>2008-07-31</date><risdate>2008</risdate><abstract>PROBLEM TO BE SOLVED: To provide a flexible board improved in heat radiation properties and miniaturized, and also to provide a semiconductor device having the flexible board. SOLUTION: A base material 3 has a semiconductor chip mounting region 8 and a metal foil pattern forming region 4 on the upper surface. A plurality of wiring patterns 2 made of a copper foil are formed in the metal foil pattern formation region 4. The plurality of wiring patterns 2 are formed in one portion of the metal foil pattern formation region 4 so that the ratio of the width of the wiring pattern 2 to the interval between the wiring patterns 2 becomes not less than 1 and not more than 8.7. COPYRIGHT: (C)2008,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | FLEXIBLE BOARD AND SEMICONDUCTOR DEVICE |
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