FLEXIBLE BOARD AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a flexible board improved in heat radiation properties and miniaturized, and also to provide a semiconductor device having the flexible board. SOLUTION: A base material 3 has a semiconductor chip mounting region 8 and a metal foil pattern forming region 4 on the uppe...

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Bibliographische Detailangaben
Hauptverfasser:	KITAZAKI HIROAKI, NAITO KATSUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flexible board improved in heat radiation properties and miniaturized, and also to provide a semiconductor device having the flexible board. SOLUTION: A base material 3 has a semiconductor chip mounting region 8 and a metal foil pattern forming region 4 on the upper surface. A plurality of wiring patterns 2 made of a copper foil are formed in the metal foil pattern formation region 4. The plurality of wiring patterns 2 are formed in one portion of the metal foil pattern formation region 4 so that the ratio of the width of the wiring pattern 2 to the interval between the wiring patterns 2 becomes not less than 1 and not more than 8.7. COPYRIGHT: (C)2008,JPO&INPIT