METHOD OF MANUFACTURING CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a technique which can inexpensively arrange a circuit chip on a circuit board sheet in an easy and simple manner to manufacture a display circuit board having the circuit chip buried therein in an easy and simple manner with a high yield for controlling respective di...

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Hauptverfasser:	IZUMI TADASHI, OHIRA KEISUKE, ISHIZUKA RYOHEI, MATSUMURA HIDEKI, NAKABAYASHI MASAHITO, FUKUDA TATSUO
Format:	Patent
Sprache:	eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technique which can inexpensively arrange a circuit chip on a circuit board sheet in an easy and simple manner to manufacture a display circuit board having the circuit chip buried therein in an easy and simple manner with a high yield for controlling respective display pixels. SOLUTION: In the method of manufacturing a circuit board by transferring a predetermined number of circuit chips on a circuit board sheet from a circuit chip holder member for holding the circuit chips thereon, locations for transfer of the predetermined number of circuit chips are selectively set for adhesion parts. The circuit board is manufactured by selectively arranging unset adhesion parts on an unset layer of the circuit board sheet and arranging the predetermined number of circuit chips on the surface thereof. COPYRIGHT: (C)2008,JPO&INPIT