DRY-POLISHING METHOD FOR ELECTRONIC COMPONENT CHIPS MADE OF NON-SINTERED LAMINATED CERAMIC AND SINTERED LAMINATED CERAMIC, AND DRY-POLISHING DEVICE THEREFOR

PROBLEM TO BE SOLVED: To provide a dry-polishing method for an electronic component chip made of laminated ceramic, which achieves efficient removal of polishing chippings, and to provide a dry-polishing device for the electronic component chip made of the laminated ceramic, which is simple in struc...

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Bibliographische Detailangaben
Hauptverfasser:	AOYAMA TAKASHI, MINAMI ISAMU, KUBO HIROYA
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a dry-polishing method for an electronic component chip made of laminated ceramic, which achieves efficient removal of polishing chippings, and to provide a dry-polishing device for the electronic component chip made of the laminated ceramic, which is simple in structure. SOLUTION: The dry-polishing method is implemented by mixing a hard medium and a polishing material with the electronic component chips made of the laminated ceramic, and agitating the resultant mass by spiral vortexes, to thereby polish the electronic component chips made of the laminated ceramic. The dry-polishing device is for use in the dry-polishing method. COPYRIGHT: (C)2008,JPO&INPIT