INSPECTION METHOD FOR SEMICONDUCTOR DEVICE AND CONTACT RESISTANCE MEASURING CIRCUIT

PROBLEM TO BE SOLVED: To easily sense in a short time measurement abnormality derived from contact resistance rise of a probe pin at the time of measurement in an inspection process of a semiconductor integrated circuit. SOLUTION: The value of current or voltage generated by applying a constant voltage to the needle point of probe pins 19, 20 is measured with a contact resistance measuring circuit for calculating the contact resistance value of the needle point from the current value and the voltage value. In the case the resistance value measured by the contact resistance measuring circuit is higher than a predetermined value, the needle point of the probe pins is polished. The contact resistance measuring circuit has needle-contact dedicated regions 11-14 of a shape capable of measuring independently of the probe pin needle point position or the number of probe pins inside a part of a semiconductor wafer or a tester. Therefore, the contact resistance is measured precisely in a short time. COPYRIGHT: (C)2008,JPO&INPIT