DEVICE AND METHOD FOR EVALUATING SURFACE OF BONDING WIRE

PROBLEM TO BE SOLVED: To provide a surface evaluation device and a surface evaluation method of a bonding wire capable of easily evaluating the clamper contamination of a wire bonder without performing wire bonding actually. SOLUTION: The device for evaluating the surface of the bonding wire compris...

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Bibliographische Detailangaben

1. Verfasser:	TAKAMORI MASAHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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