DEVICE AND METHOD FOR EVALUATING SURFACE OF BONDING WIRE

PROBLEM TO BE SOLVED: To provide a surface evaluation device and a surface evaluation method of a bonding wire capable of easily evaluating the clamper contamination of a wire bonder without performing wire bonding actually. SOLUTION: The device for evaluating the surface of the bonding wire comprises: a drive mechanism for conveying the bonding wire 1 at arbitrary speed in a prescribed section; a pair of removable clamp pads 5 arranged in the prescribed section oppositely; an actuator for opening/closing the clamp pad 5; a clamper opening/closing circuit that is connected to the actuator and performs energization periodically so that the clamp pad 5 repeats clamping and releasing the bonding wire 1; a resistance value measuring circuit for measuring the resistance value between the clamp pads 5 while the clamp pads 5 are closed in a state where no bonding wires 1 are interposed; and a capillary 6. COPYRIGHT: (C)2008,JPO&INPIT