METHOD FOR ADJUSTING CONCENTRATION OF METAL ION, DEVICE FOR ADJUSTING CONCENTRATION OF METAL ION, AND PLATING METHOD

PROBLEM TO BE SOLVED: To provide a method for stably keeping the concentration of a metal ion in a plating solution; a device suitable for carrying out the method; and a plating method using them. SOLUTION: This adjusting method includes: placing an anode 30 and a cathode 40 made from a metal materi...

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Hauptverfasser:	KAMIBAYASHI YOSHIHIRO, SUGIYAMA TOMONORI, SATO DAIKI, SASAKI SHINJI, KONNO MASAHIKO, SHIBUYA KAZUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for stably keeping the concentration of a metal ion in a plating solution; a device suitable for carrying out the method; and a plating method using them. SOLUTION: This adjusting method includes: placing an anode 30 and a cathode 40 made from a metal material having a lower hydrogen overvoltage than that of a metal material composing the anode 30, in a plating solution 20; and applying a direct-current voltage between the anode 30 and the cathode 40 from a direct-current power supply E0. Thereby, the concentration Xn+of the metal ion in the plating solution 20 is adjusted. COPYRIGHT: (C)2008,JPO&INPIT