APPARATUS AND METHOD FOR PROCESSING SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC INSTRUMENT

PROBLEM TO BE SOLVED: To reduce the footprint of an apparatus as a whole, by improving the flexibility in the configuration of the apparatus, by constituting a block from minimum units of the apparatus, and by improving the size reduction of the apparatus as a whole, without the accompanying of the...

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Bibliographische Detailangaben
1. Verfasser: ITO YOSHITAKE
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To reduce the footprint of an apparatus as a whole, by improving the flexibility in the configuration of the apparatus, by constituting a block from minimum units of the apparatus, and by improving the size reduction of the apparatus as a whole, without the accompanying of the problems of the constitution of the apparatus. SOLUTION: The apparatus includes processing unit arranging parts 21 to 23 which are constituted by arranging, in one direction, a plurality of processing units performing the predetermined processing to a substrate G to be processed; first conveyance mechanisms which are provided in the processing units arranging parts and convey the substrate to be processed; and second conveyance mechanisms 11 to 15, which are provided on the outside of the processing unit arranging parts and are to be fixed on approximately extension of the one direction or to be fixed in the direction orthogonal to substantially the extension of the one direction or/and to be movable on lines parallel with the extension of the one direction, and are constituted so as to freely deliver the substrate to be processed directly or indirectly to the first conveyance mechanisms. COPYRIGHT: (C)2008,JPO&INPIT