FORMING METHOD OF PHASE-CHANGE MATERIAL LAYER, MANUFACTURING METHOD OF PHASE-CHANGE MEMORY ELEMENT USING THIS METHOD

PROBLEM TO BE SOLVED: To provide a forming method of a phase-change material layer and a manufacturing method of a phase-change memory element using this method. SOLUTION: There is provided a forming method of a phase-change layer, for forming the phase-change layer by an electrochemical deposition...

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Bibliographische Detailangaben
Hauptverfasser:	KANG YOUN-SEON, SHIN WOONGUL, HAKU KEITO, OH SEUNG-JIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a forming method of a phase-change material layer and a manufacturing method of a phase-change memory element using this method. SOLUTION: There is provided a forming method of a phase-change layer, for forming the phase-change layer by an electrochemical deposition method, including: a first step of forming electrolyte by mixing a precursor and a solvent containing elements that constitute the phase-change layer respectively; a second step of immersing into the electrolyte an anode plate and a cathode plate having a substrate on which the phase-change layer is deposited in a state of being spaced from each other; a third step of setting a depositing condition of the phase-change layer; and a fourth step of applying voltage between the anode plate and the cathode plate. COPYRIGHT: (C)2008,JPO&INPIT