SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent the generation of a catching void in a solder part between a second metallic body and a third metallic body in a semiconductor device configured by laminating a first metallic body, a semiconductor element, the second metallic body, and the third metallic body and connecting gaps between their laminated components through solder. SOLUTION: The second metallic body 4 and the third metallic body 5 are laminated through solder so that out of end portions in a soldering surface 4a of the second metallic body 4 forming a square, corner portions 41 of which the distance L1 from the center K of the soldering surface 4a is long are superposed to a solder spread preventing groove 10 and side portions 42 of which the distance L2 from the center K is short are arranged on the inner peripheral side of the solder spread preventing groove 10 without being superposed to the groove 10. COPYRIGHT: (C)2008,JPO&INPIT