BACKLIGHTING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE

PROBLEM TO BE SOLVED: To provide a backlighting device and a liquid crystal display device in which productivity can be enhanced by securing a wire board mounting an LED and an array base easily, and heat generated from the LED can be dissipated uniformly and efficiently. SOLUTION: The light source...

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Bibliographische Detailangaben
Hauptverfasser:	TAKATSUKA HIROSHI, KAWASE MITSUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING NON-LINEAR OPTICS NON-PORTABLE LIGHTING DEVICES OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a backlighting device and a liquid crystal display device in which productivity can be enhanced by securing a wire board mounting an LED and an array base easily, and heat generated from the LED can be dissipated uniformly and efficiently. SOLUTION: The light source array 7 of a backlighting device 10 comprises a resin wiring board 22 mounting a plurality of LEDs 21, a metal array base 16 for holding the wiring board 22, and an adhesive 23 provided between the wiring board and metal array base, wherein the adhesive 23 consists of a heat conductor and an insulator. Heat generated from the LED 21 is transmitted from the thermal via 52 of the wiring board 22 to the array base 16 and the back chassis 8 through the adhesive 23 for dissipation. Since the wiring board 22 adheres to the array base 16 through the adhesive 23, heat from the LED 21 can be transmitted uniformly to the array base 16, and fixing is facilitated as compared with a case where the wiring board 22 is secured by means of a screw or the like. COPYRIGHT: (C)2008,JPO&INPIT