ELECTRONIC COMPONENT, AND MOUNTING STRUCTURE THEREOF

PROBLEM TO BE SOLVED: To achieve a highly reliable mounting structure by surely preventing the generation of solder cracks in an electronic component such as a laminate ceramic capacitor. SOLUTION: The electronic component is provided with terminal electrodes 2 and 3 on ends of an electronic compone...

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Bibliographische Detailangaben
1. Verfasser: IGARASHI KATSUHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To achieve a highly reliable mounting structure by surely preventing the generation of solder cracks in an electronic component such as a laminate ceramic capacitor. SOLUTION: The electronic component is provided with terminal electrodes 2 and 3 on ends of an electronic component base body (laminate ceramic capacitor chip 1). One part of the conductor layer configuring the terminal electrodes 2 and 3 is formed so as be to spaced from the other members. For example, conductive resin layers 2b and 3b as conductor layers on upper sides of the terminal electrodes 2 and 3 are provided, and the ends of the conductive resin layers 2b and 3b are formed into a reversely inclined surface. Alternatively, spaces B are each formed between the conductive resin layers 2b and 3b and the conductor layers (base electrode layers 2a and 3a) formed therebelow on the ends of the conductive resin layers 2b and 3b. COPYRIGHT: (C)2008,JPO&INPIT