SYSTEM FOR MEASURING CHARACTERISTIC OF ELECTRONIC ELEMENT

PROBLEM TO BE SOLVED: To provide a characteristic measuring system capable of materializing a reliable Kelvin connection irrespective of whether or not the contact states of measuring probes are good, no matter how much an electronic element such as a semiconductor chip is miniaturized. SOLUTION: Th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: TAKESHIMA MASAAKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a characteristic measuring system capable of materializing a reliable Kelvin connection irrespective of whether or not the contact states of measuring probes are good, no matter how much an electronic element such as a semiconductor chip is miniaturized. SOLUTION: The characteristic measuring system MS is configured by performing Kelvin connection of two measuring probes to a semiconductor chip 3. The semiconductor chip 3 is arranged on conductive flat springs 2a-2d partitioned electrically into a plurality of portions, and its characteristic is measured in a state of being pressed by a combined probe PR. COPYRIGHT: (C)2008,JPO&INPIT