POSITION CONTROLLED DUAL MAGNETRON

PROBLEM TO BE SOLVED: To provide a device for cleaning a redeposited substance, wherein it is prevented that a material substance redeposited on the central part of a target is peeled from the target, resulting in failure of an integrated circuit. SOLUTION: In the dual magnetron for sputtering, the...

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Bibliographische Detailangaben
Hauptverfasser:	LAM WINSOR, HONG ILYOUNG RICHARD, YANG HONG S, PAVLOFF CRISTOPHER M, GUNG TZA-JING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a device for cleaning a redeposited substance, wherein it is prevented that a material substance redeposited on the central part of a target is peeled from the target, resulting in failure of an integrated circuit. SOLUTION: In the dual magnetron for sputtering, the positions of the magnetron can be moved in complementary radial directions between sputter deposition and target cleaning. The magnetrons have different characteristics of size, strength, and imbalance. The source magnetron is smaller, stronger, and unbalanced source magnetron 62 and is positioned near the edge of the wafer in sputter deposition and etching. The auxiliary magnetron 64 is larger, weak, and more balanced and used for cleaning the center of the target and guiding sputter ions from the source magnetron in sputter deposition. COPYRIGHT: (C)2008,JPO&INPIT