LOW-TEMPERATURE JOINING MATERIAL AND JOINING METHOD

PROBLEM TO BE SOLVED: To provide a joining material and a joining process that can achieve low-temperature joining during the joining stage in a mounting process, and to provide a semiconductor package in which no long term reliability is impaired even under a high temperature environment. SOLUTION:...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IDE HIDEKAZU, ISHII TOSHIAKI, MORITA TOSHIAKI, YASUDA TAKESUKE, HOZOJI HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POWDER METALLURGY SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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