LOW-TEMPERATURE JOINING MATERIAL AND JOINING METHOD
PROBLEM TO BE SOLVED: To provide a joining material and a joining process that can achieve low-temperature joining during the joining stage in a mounting process, and to provide a semiconductor package in which no long term reliability is impaired even under a high temperature environment. SOLUTION:...
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| creator | IDE HIDEKAZU ISHII TOSHIAKI MORITA TOSHIAKI YASUDA TAKESUKE HOZOJI HIROYUKI |
| description | PROBLEM TO BE SOLVED: To provide a joining material and a joining process that can achieve low-temperature joining during the joining stage in a mounting process, and to provide a semiconductor package in which no long term reliability is impaired even under a high temperature environment. SOLUTION: In a joining material using metallic particles whose average grain size coated with an organic matter is ≤100 μm, the joining material is characterized in that one or more peaks are possessed in a grain-size distribution in the volume criterium of ≤100 nm and ≤100 nm-100 μm respectively and that the carbon number of the organic component coating the metallic particles is 2-8. COPYRIGHT: (C)2008,JPO&INPIT |
| format | Patent |
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| subjects | CASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POWDER METALLURGY SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER |
| title | LOW-TEMPERATURE JOINING MATERIAL AND JOINING METHOD |
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