SUBSTRATE INCORPORATING ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To provide a substrate incorporating an electronic component which can be made compact by sharply reducing the plane dimensions (plane area) or the height dimensions. SOLUTION: In the substrate 100 incorporating an electronic component 30 mounted between a pair of wiring substr...
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| creator | INOUE AKINOBU |
| description | PROBLEM TO BE SOLVED: To provide a substrate incorporating an electronic component which can be made compact by sharply reducing the plane dimensions (plane area) or the height dimensions. SOLUTION: In the substrate 100 incorporating an electronic component 30 mounted between a pair of wiring substrates 10 and 20, the wiring substrates 10 and 20 are connected electrically through solder balls 40, the other wiring substrate 20 opposing one wiring substrate 10 mounting the electronic component 30 is provided, at a position opposing the electronic component 30, with an opening 24 larger than the planar profile of the electronic component 30 and a gap between the pair of wiring substrates 10 and 20 is filled with sealing resin 50. COPYRIGHT: (C)2008,JPO&INPIT |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | SUBSTRATE INCORPORATING ELECTRONIC COMPONENT |
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