SUBSTRATE INCORPORATING ELECTRONIC COMPONENT

SUBSTRATE INCORPORATING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a substrate incorporating an electronic component which can be made compact by sharply reducing the plane dimensions (plane area) or the height dimensions. SOLUTION: In the substrate 100 incorporating an electronic component 30 mounted between a pair of wiring substr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: INOUE AKINOBU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate incorporating an electronic component which can be made compact by sharply reducing the plane dimensions (plane area) or the height dimensions. SOLUTION: In the substrate 100 incorporating an electronic component 30 mounted between a pair of wiring substrates 10 and 20, the wiring substrates 10 and 20 are connected electrically through solder balls 40, the other wiring substrate 20 opposing one wiring substrate 10 mounting the electronic component 30 is provided, at a position opposing the electronic component 30, with an opening 24 larger than the planar profile of the electronic component 30 and a gap between the pair of wiring substrates 10 and 20 is filled with sealing resin 50. COPYRIGHT: (C)2008,JPO&INPIT