ELECTRONIC COMPONENT MANUFACTURING METHOD AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method capable of removing burrs in the state of appropriately rounding a corner part, sufficiently exposing the end of an internal electrode and forming a high-contrast marker, and an electronic component. SOLUTION: On a lower l...

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Bibliographische Detailangaben
Hauptverfasser: YAMANO KAZUHIKO, MIYOSHI HIROMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic component manufacturing method capable of removing burrs in the state of appropriately rounding a corner part, sufficiently exposing the end of an internal electrode and forming a high-contrast marker, and an electronic component. SOLUTION: On a lower layer exterior material 2 on a base 10, insulating layers 31-33 and the internal electrodes 41 and 42 are laminated to form an element body 3 and a marker 5 is formed. Then, after a laminate comprising the lower layer exterior material 2, the element body 3 and the marker 5 is cut into a plurality of chips 6, the base 10 is peeled off and the chips 6 are calcinated. Thereafter, the respective chips 6 are polished in a barrel and an inductor 1 is manufactured. The hardness of the marker 5 is set larger than the hardness of the lower layer exterior material 2 and the hardness of the element body 3. Preferably, the hardness of the lower layer exterior body 2 and the hardness of the element body 3 are made different corresponding to a difference between the edge rounding time of the lower layer exterior material 2 and the exposure time of the outer ends 41b and 42b of the internal electrodes 41 and 42. COPYRIGHT: (C)2008,JPO&INPIT