CONDUCTIVE PASTE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a manufacturing method of conductive paste that does not generate any aggregated blocks easily as compared with before and is capable of suppressing the mixture of unneeded constituents. SOLUTION: The manufacturing method of conductive paste comprises: a process for...

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Bibliographische Detailangaben
Hauptverfasser: BESSHO HISAMI, TERASAKI SHINGO, KANBE YUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of conductive paste that does not generate any aggregated blocks easily as compared with before and is capable of suppressing the mixture of unneeded constituents. SOLUTION: The manufacturing method of conductive paste comprises: a process for heating solution containing metal salt and a first organic solvent, reducing the metal salt for generating a metal ultra-fine particle, and obtaining a composite solution containing the metal ultra-fine particle; a process for removing a first organic solvent and a reaction residue from the composite solution and obtaining a metal ultra-fine particle in a non-dried and non-hardened state; and a process for mixing the metal ultra-fine particle in a non-dried and non-hardened state with a second organic solvent for pasting. COPYRIGHT: (C)2008,JPO&INPIT