DEVICE FOR INSPECTING CIRCUIT BOARD

PROBLEM TO BE SOLVED: To solve a problem wherein inspection efficiency gets low by a replacement period of a contact probe or an anisotropic conductive sheet contacting with a bump. SOLUTION: A device inspects an electric characteristic in a circuit board 10 of an inspection object formed with solder ball 12 as an external connection terminal on one face side. The device includes a testing board 16 with the contact probe 14 corresponding to the solder ball 12 of the circuit board 10; the anisotropic conductive sheet 24 arranged between the solder ball 12 and the contact probe 14, and for forming a conductive path for connecting the solder ball 12 electrically to the contact probe 14 by pressing forces of the contact probe 14 and the solder ball 12; and a feed roller 20 and a drawing roller 22 as a slide means for sliding the anisotropic conductive sheet 24 to bring pressed portions pressed by the contact probe 14 and the solder ball 12 into different directions, when the pressing forces are released. COPYRIGHT: (C)2008,JPO&INPIT