LOW-MELT-VISCOSITY PHENOL NOVOLAK RESIN, ITS PREPARATION METHOD AND ITS USE

PROBLEM TO BE SOLVED: To provide a phenol novolak resin having low hygroscopicity, heat resistance, flame retardance, mechanical properties and adhesion properties and lower melt viscosity than that of a conventional biphenylylene-crosslinked phenol novolak resin. SOLUTION: The phenol novolak resin...

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1. Verfasser:	MITANI NORIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a phenol novolak resin having low hygroscopicity, heat resistance, flame retardance, mechanical properties and adhesion properties and lower melt viscosity than that of a conventional biphenylylene-crosslinked phenol novolak resin. SOLUTION: The phenol novolak resin contains both a phenol and a dihydric phenol within the molecule and has a polymer unit containing a biphenylylene crosslinking group and a phenol novolak polymer unit containing a methylene crosslinking group, provided that the ratio of polymerization degrees of the two polymer units falls within a specific range. The resin can be used, for example, as an epoxy hardener, an epoxy resin, a flame retardant, an adhesive or a semiconductor device. COPYRIGHT: (C)2008,JPO&INPIT